421A Liquid Tin is a clear yellow immersion tin solution designed to coat copper traces and solder deposits with a thick coating layer of tin. Quickly tinplates copper circuits on PC boards in 7 -10 minutes at room temperature. Provides excellent solderability. Protects against oxidation. No mixing or dilution required. The deposited tin is readily solderable and it extends the work life of circuits by protecting it from corrosion. The pure tin deposit provides excellent corrosion resistance, which is free of co‑deposited organics. 421A ensures good solderability for solder deposits by cleaning them and by making their surface bright and active.
Materials and Equipment:
The liquid tin should be used with equipment made of polypropylene, polyethylene, Teflon, or similar materials. DO NOT use stainless steel. Heaters should be made of Teflon or quartz.
To tin copper or solder deposits:
Dilution is not required. Volume lost due to
evaporation can be replaced with DI water. Chemical replenishment is not recommended.
1. Clean the board.
2. Rinse cleaning residues with water.
3. Immerse in liquid tin for the duration corresponding
to the thickness you need.
4. Rinse with warm water.
5. Rinse with DI water.
6. Dry.